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| IPD50N06S4-09 OptiMOS(R)-T2 Power-Transistor Product Summary V DS R DS(on),max ID 60 9.0 50 PG-TO252-3-11 V m A Features * N-channel - Enhancement mode * AEC qualified * MSL1 up to 260C peak reflow * 175C operating temperature * Green Product (RoHS compliant) * 100% Avalanche tested Type IPD50N06S4-09 Package PG-TO252-3-11 Marking 4N0609 Maximum ratings, at T j=25 C, unless otherwise specified Parameter Continuous drain current Symbol ID Conditions T C=25C, V GS=10V1) T C=100C, V GS=10V2) Pulsed drain current2) Avalanche energy, single pulse2) Avalanche current, single pulse Gate source voltage Power dissipation Operating and storage temperature IEC climatic category; DIN IEC 68-1 I D,pulse E AS I AS V GS P tot T j, T stg T C=25C I D=25A T C=25C Value 50 47 200 87 50 20 71 -55 ... +175 55/175/56 mJ A V W C - Unit A Rev. 1.2 page 1 2009-07-01 IPD50N06S4-09 Parameter Symbol Conditions min. Values typ. max. Unit Thermal characteristics2) Thermal resistance, junction - case SMD version, device on PCB R thJC R thJA minimal footprint 6 cm2 cooling area3) Electrical characteristics, at T j=25 C, unless otherwise specified Static characteristics Drain-source breakdown voltage Gate threshold voltage Zero gate voltage drain current V (BR)DSS V GS=0V, I D= 1mA V GS(th) I DSS V DS=V GS, I D=34A V DS=60V, V GS=0V, T j=25C V DS=60V, V GS=0V, T j=125C2) Gate-source leakage current Drain-source on-state resistance I GSS R DS(on) V GS=20V, V DS=0V V GS=10V, I D=50A 60 2.0 3.0 0.01 4.0 1 A V 2.1 62 40 K/W - 5 7.1 100 100 9.0 nA m Rev. 1.2 page 2 2009-07-01 IPD50N06S4-09 Parameter Symbol Conditions min. Values typ. max. Unit Dynamic characteristics2) Input capacitance Output capacitance Reverse transfer capacitance Turn-on delay time Rise time Turn-off delay time Fall time Gate Charge Characteristics2) Gate to source charge Gate to drain charge Gate charge total Gate plateau voltage Reverse Diode Diode continous forward current2) Diode pulse current2) Diode forward voltage IS I S,pulse V SD T C=25C V GS=0V, I F=50A, T j=25C V R=30V, I F=I S, di F/dt =100A/s 0.6 0.95 50 200 1.3 V A Q gs Q gd Qg V plateau V DD=48V, I D=50A, V GS=0 to 10V 17 4 36 5.6 22 8 47 V nC C iss C oss Crss t d(on) tr t d(off) tf V DD=30V, V GS=10V, I D=50A, R G=3.5 V GS=0 V, V DS=25 V, f =1 MHz 2911 715 30 15 40 20 5 3785 930 60 ns pF Reverse recovery time2) t rr - 45 - ns Reverse recovery charge2) 1) Q rr - 40 - nC Current is limited by bondwire; with an R thJC = 2.1K/W the chip is able to carry 67A at 25C. Defined by design. Not subject to production test. 2) 3) Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm 2 (one layer, 70 m thick) copper area for drain connection. PCB is vertical in still air. Rev. 1.2 page 3 2009-07-01 IPD50N06S4-09 1 Power dissipation P tot = f(T C); V GS 6 V 2 Drain current I D = f(T C); V GS 6 V 80 70 60 50 60 40 50 P tot [W] 40 30 I D [A] 0 50 100 150 200 30 20 20 10 10 0 0 0 50 100 150 200 T C [C] T C [C] 3 Safe operating area I D = f(V DS); T C = 25 C; D = 0 parameter: t p 1000 4 Max. transient thermal impedance Z thJC = f(t p) parameter: D =t p/T 101 1 s 0.5 100 0.1 100 10 s I D [A] 100 s Z thJC [K/W] 0.05 10-1 0.01 1 ms 10 10-2 single pulse 1 0.1 1 10 100 10-3 10-6 10-5 10-4 10-3 10-2 10-1 100 V DS [V] t p [s] Rev. 1.2 page 4 2009-07-01 IPD50N06S4-09 5 Typ. output characteristics I D = f(V DS); T j = 25 C parameter: V GS 200 10 V 8V 7.5 V 6 Typ. drain-source on-state resistance R DS(on) = f(I D); T j = 25 C parameter: V GS 20 5.5 V 6V 6.5 V 7V 7.5 V 18 160 7V 16 R DS(on) [m] 120 I D [A] 14 6.5 V 80 6V 12 10 40 5.5 V 8 10 V 0 0 1 2 3 4 6 0 40 80 120 160 200 V DS [V] I D [A] 7 Typ. transfer characteristics I D = f(V GS); V DS = 6V parameter: T j 200 -55 C 25 C 8 Typ. drain-source on-state resistance R DS(on) = f(T j); I D = 50 A; V GS = 10 V 13 12 160 11 10 175 C R DS(on) [m] 3 4 5 6 7 8 120 I D [A] 9 8 7 80 40 6 5 0 4 -60 -20 20 60 100 140 180 V GS [V] T j [C] Rev. 1.2 page 5 2009-07-01 IPD50N06S4-09 9 Typ. gate threshold voltage V GS(th) = f(T j); V GS = V DS parameter: I D 4 10 Typ. capacitances C = f(V DS); V GS = 0 V; f = 1 MHz 104 3.5 350 A Ciss V GS(th) [V] 3 35 A C [pF] 103 Coss 2.5 102 2 Crss 1.5 -60 -20 20 60 100 140 180 101 0 5 10 15 20 25 30 T j [C] V DS [V] 11 Typical forward diode characteristicis IF = f(VSD) parameter: T j 103 12 Avalanche characteristics I A S= f(t AV) parameter: T j(start) 100 25 C 100 C 10 2 10 150 C 175 C 25 C 25 C 10 1 I AV [A] 175 C I F [A] 1 100 0 0.2 0.4 0.6 0.8 1 1.2 1.4 0.1 0.1 1 10 100 1000 V SD [V] t AV [s] Rev. 1.2 page 6 2009-07-01 IPD50N06S4-09 13 Avalanche energy E AS = f(T j) parameter: I D 100 14 Drain-source breakdown voltage V BR(DSS) = f(T j); I D = 1 mA 66 80 25 A 64 V BR(DSS) [V] 60 62 E AS [mJ] 40 60 20 58 0 25 75 125 175 56 -55 -15 25 65 105 145 T j [C] T j [C] 15 Typ. gate charge V GS = f(Q gate); I D = 50 A pulsed parameter: V DD 10 9 8 7 6 12 V 48 V 16 Gate charge waveforms V GS Qg V GS [V] 5 4 3 2 V g s(th) Q g (th) 1 0 0 5 10 15 20 25 30 35 40 Q sw Q gs Q gd Q gate Q gate [nC] Rev. 1.2 page 7 2009-07-01 IPD50N06S4-09 Published by Infineon Technologies AG 81726 Munich, Germany (c) Infineon Technologies AG 2009 All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. Rev. 1.2 page 8 2009-07-01 IPD50N06S4-09 Revision History Version Date Changes Update of RthJC and related parameters from 1.7K/W to 22.08.2008 2.1K/W 01.07.2009 Update of SOA diagram Revision 1.1 Revision 1.2 Rev. 1.2 page 9 2009-07-01 |
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